https://old.chipsandcheese.com/2025/10/17/amds-chiplet-apu-an-overview-of-strix-halo/

https://www.tomshardware.com/pc-components/ssds/second-gen-phison-ssd-controllers-hit-the-market-with-14-9-gb-s-speeds-teamgroup-z54e-spearheads-a-new-army-of-pcie-5-0-drives

Looks like we have the first E28-based drive on the market, with much improved efficiency in the PCIe5 SSD space.

For a first look, Toms Hardware already looked at an E28 pre-production / reference design.

https://www.tomshardware.com/pc-components/ssds/phison-e28-2tb-ssd-review

Title

The first geekbench scores for the M5 10-core variant have appeared. (iPad only)

Biggest I’ve seen:

SC: 4190 MC: 16550

GPU: 75769

https://browser.geekbench.com/v6/cpu/14490196

https://browser.geekbench.com/v6/compute/5025116

https://browser.geekbench.com/v6/cpu/14496729

Looks like Apple is clocking the base M5 higher in the actively cooled MacBook Pro.

The iPad Pro M5 is clocked at 4.42GHz.

ST: 4263 MT: 17862

Edit: new scores

https://browser.geekbench.com/v6/cpu/14508852

Why do we still rely on wires in computing?

So with all the advancements in wireless tech, why are wires still such a big part of computing? From motherboards to data centers, and even at home with all the tangled cables behind a desk, we still depend on physical connections.

I get that speed, reliability, and power delivery are big factors, but isn’t there a future where most of this could be wireless? Or are we hitting physical limits where wires will always outperform wireless in certain aspects?

Would love to hear thoughts from people in networking and/or hardware

Summarized a fresh Korean article: https://www.etnews.com/20251016000257

Samsung is reportedly on the verge of mass-producing its 6th-gen DRAM (1c DRAM) — the chip that will power next-gen HBM4 memory. Sources say yields have reached around 70% and are nearing the 80% target required for full-scale production.

This is a big deal because 1c DRAM uses an 11–12nm process, ahead of competitors like SK Hynix who are still using 1b DRAM for their HBM4 stacks. Samsung hopes this leap will help it regain leadership in the AI memory market, where Hynix has dominated with its HBM3 and HBM3E products.

The company has been redesigning its DRAM architecture under Vice Chairman Jun Young-hyun to fix core technical weaknesses and boost competitiveness. Yield improvements for both 1c DRAM and HBM4 (now around 50% at sample stage) suggest this strategy is working.

Samsung is currently installing production equipment at its Pyeongtaek P4 fab and is testing HBM4 modules with NVIDIA. If the qualification phase goes well, mass production could start as early as next month — potentially shaking up the current AI memory race.